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DBA (Direct Bonded Aluminum) substrate
DBA (Direct Bonded Aluminum) substrate
DBA (Direct Bonded Aluminum) substrate
Mitsubishi Materials is a leading company of DBA (Direct Bonded Aluminum) substrates used for the high power modules with high reliability.
Monozukuri and R&D Strategy Dept. have been responsible for DBA Substrate business from April, 2022.
Provide a stable supply of excellent quality
- Have been used for inverter modules of hybrid vehicles and industrial machinery.
- High thermal conductivity of 8 times or more of alumina.
- Insulated ceramics substrate with high reliability.
Advantages of DBA substrates from Mitsubishi Materials
- The thermal cycle life of DBA substrates are 10 times longer than that of Cu circuit layer type.
- No cracks generate in the solder between Si chip and DBA substrate.
- No cracks generate in the ceramics.
- Heat release of semiconductor device.
- Insulation of current for semiconductor device.
Application examples
- Inverter module for hybrid and electric vehicle
- Power module for electric train and power plant
Foreseeable future of DBA
- Improvement in power cycle tolerance
- Improvement in heat conductivity
- Expansion of the service temperature range to a high-temperature range (over 200 degrees)
Documents
No documents, now.
Responsible Dept.: Monozukuri and R&D Strategy Dept.
Plant: Fuji-Oyama Plant
