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Mitsubishi MaterialsElectronic Materials and Components

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Gold-tin (AuSn) Alloy Solder Paste

Mitsubishi Materials' Gold-tin(AuSn) alloy paste offers high process flexibility.

Useful information

Applications

Advantages

Product Line-up

Supplying
Method
Composition Particle size Flux type viscosity Gas type
during reflow
Printing Au78/Sn22 16-53um
16-32um (as Type 4)
≦32um
5-16um (as Type 6)
MSN
RA (AS2)
Water soluble (MF1)
180-280Pa・s N2
≦11um (For thin film) RA (AS2) 20-50Pa・s N2
Dispensing 5-16um (as Type 6)
16-32um (as Type 4)
RMA (AS1)
RA (AS2)
Water soluble (MF1)
50-130Pa・s N2
5-16um (as Type 6) Cleaning free (MRF2) formic acid+N2
Pin transfer ≦11um (as Type 7) RA (AS2)
Water soluble (MF1)
10-50Pa・s N2
Cleaning free (MRF2) formic acid+N2