Gold-tin (AuSn) Alloy Solder Paste
Mitsubishi Materials' Gold-tin(AuSn) alloy paste offers high process flexibility.
Useful informationApplications
- Die bonding (high brightness LEDs, peltier elements and power semiconductors) for vehicle installations, lightings, thermoelectric exchange modules and others .
- Sealing (crystal devices and SAW devices) for mobile communications, base stations, MEMS sensors and others.
Advantages
- Lower cost by batch processing of printing and reflow (heat-treatment)
- Available for dispensing and pin transfer
- Excellent wettability
- Capable of bonding small parts which is not easy with preform foil materials.
- No high cost for metal molds
- Higher thermal conductivity and bond strength than those of thermosetting Ag epoxy resin
- Easily able to form electrode bumps
- New paste that is environmentally friendly (Water-soluble paste, Cleaning-free paste)
Product Line-up
| Supplying Method |
Composition | Particle size | Flux type | viscosity | Gas type during reflow |
|---|---|---|---|---|---|
| Printing | Au78/Sn22 | 16-53um 16-32um <32um 5-16um |
MSN RA(AS2,AS3) Water soluble |
180-300Pa·s | N2 |
| <11um | RA(AS2, AS3) | 20–50Pa·s | N2 | ||
| Dispensing | 5-16um 16-32um |
RMA(AS1) RA(AS2) Water soluble |
50–130Pa·s | N2 | |
| Cleaning free | formic acid＋N2 |
||||
| Pin transfer | <11um | RA(AS2) | 10–50Pa·s | N2 | |
| Cleaning free | formic acid＋N2 |
- For any other combinations of alloy composition, particle size and flux type, please contact us
Useful information