Precision Silicon Products
We manufacture internal parts primarily for semiconductor front-end processing equipment from crystalline silicon ingots. Please consider our high-purity silicon processed products as reduction of metal contamination on wafers, particle countermeasures, heat-resistant parts, and chemical-resistant parts.
Characteristics
High-Precision Processing of Brittle Materials | Semiconductor manufacturing requires extremely high precision, necessitating extremely strict tolerance control. Component dimensional accuracy is on the order of a few microns. Leveraging our years of expertise in silicon crystal manufacturing, we achieve complex and highly precise processing of silicon, an extremely hard and brittle material. |
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Thorough Quality Control and High-Precision Dimensional Measurement | We employ a variety of advanced measuring instruments to ensure quality control. We have verified the traceability of all measuring instruments with certification agencies |
Clean Product Manufacturing and Environment | Silicon is the material on earth that can be industrially produced with the highest purity, and it is possible to reduce the impurity concentration. Furthermore, surface cleaning is possible using silicon chemicals used in semiconductor front-end processes and electronic materials. We perform high-purity cleaning in a clean room. Furthermore, packaging is performed in a clean room to ensure the delivery of clean products. |
Manufacturing Chemical-Resistant Parts | Silicon has excellent resistance to many acids and alkalis at room temperature and below. Manufacturing parts using silicon meets the demand for parts with excellent chemical resistance. |
Manufacturing Heat-Resistant Parts | The melting point of silicon is 1400°C. Unlike quartz glass, its crystal structure does not change with temperature (from alpha to beta). In addition, it has thermal conductivity approximately 100 times greater than glass. This meets the demand for parts in applications where rapid cooling or heating (heat shock) is required with ceramics or quartz. Silicon also has excellent infrared transparency. Using quartz components in equipment equipped with infrared heaters can cause partial heating, potentially resulting in heat shock. Silicon components solve this problem. |
Manufacturing Heat-Uniform Parts | As mentioned above, silicon has excellent thermal conductivity. In addition, it is capable of transmitting infrared rays. Compared to heat-resistant parts made of quartz or ceramics, silicon's infrared transparency ensures uniform radiation effects near high-temperature areas (the part itself does not cast a shadow, which can contribute to temperature drop or uneven temperature). |
Manufacturing Large Sized Parts | A typical silicon wafer is 300mm (12 inches) in diameter and 0.725mm thick. However, we can obtain large silicon ingots from our group and affiliated companies. We can also manufacture parts with diameters of 500mm and thicknesses of 20mm. While typical polycrystalline silicon has random crystal orientation, columnar crystal silicon has a vertically aligned crystal orientation, making it an excellent material that is less likely to crack or pop in high-temperature environments. |
Type | Single crystal Silicon Parts | Columnar crystal Silicon Parts |
Maximum Size | ≦ Φ600mm | ≦ □1200mm |
Conductivity | B-doped, p-type | B-doped, p-type |
Resistance Range | ① ≦ 100Ωcm ② ≦ 5Ωcm ③ ≦ 0.1Ωcm |
① ≦ 5Ωcm ② ≦ 0.1Ωcm ③ ≦ 0.01Ωcm |
Processing Examples | Grinding, Hole Drilling | Grinding, Hole Drilling |
- If you have any other questions, please contact us.
Usage
We manufacture various shapes of silicon parts for semiconductor manufacturing equipment. Plasma etching, gas etching, cryo-etching, ALE (atomic layer etching), Plasma CVD, ALD (atomic layer deposition), thermal CVD, lamp annealing, flash annealing, thermal diffusion furnace Parts for ion implantation equipment, parts for CMP equipment, parts for LCD manufacturing equipment, Parts for wet cleaning equipment, raw material plates for sputtering targets, and so on.
Topix
Application examples for processed parts are available as below.