The thickness and shape of
AuSn joint material can be
Hope to flexibly change the thickness and shape of AuSn
- When forming a AuSn thin deposition film on a chip, the material usage efficiency during film formation is poor and expensive.
- When the electrode shape of the chip with AuSn deposition film is changed for each product type, it is necessary to manufacture a jig (exposure mask, etc.) for each product, which increases the cost and difficulty to manage.
AuSn paste is a solder paste that is a mixture of AuSn powder and flux. AuSn alloys of any shape and thickness can be formed by applying and reflowing using the printing, dispensing, and pin transfer methods.
The unit price for chips with AuSn deposition film is very high.
Since the shape and supplying thickness of the paste can be freely changed, the shape and thickness of the chip electrode can be changed simply by replacing the printing mask or modifying the program of the dispensing device.
If the electrode shape is different for each type of chip with AuSn deposition film for flip-chip bonding, it is necessary to manufacture a jig for each electrode shape, which increases the cost and complicates management.
Can be applied in any design by changing the program of the dispense robot.
There are three possible construction methods for AuSn paste:
The shape can be changed freely just by adjusting the settings of the printing mask or dispenser.
The thickness of the joint material can also be adjusted by changing the settings of the printing mask or dispenser.
Other solutions for AuSn paste
Bond strength is not stable due to substrate roughness
The chip is misaligned when bonding
Hope to reduce the cost of the cleaning process
There are problems when using paste in mass production
Other related solutions
This solution utilizes
Mitsubishi Materials' AuSn paste.