AuSn PASTE
Solution
Water-soluble paste,
Cleaning-free paste
Challenge
Hope to reduce the cost of the cleaning process
- Do not want to carry out the cleaning process using the dedicated cleaning solution, and want to eliminate the cleaning process and increase work efficiency and reduce cost.
- Flux residue cleaning with cleaning chemical contaminates the device surface.
- Looking for materials that does not contain halogen.
Solution Overview
■ Water-soluble paste
It is a product that does not contain rosin and uses an alternative resin that is soluble in water. In addition, it is a halogen-free product that is environmentally friendly.
■ Cleaning-free paste (formic acid reflow only)
Newly developed flux that thermally decomposes during reflow. No flux residue remains and cleaning is not required. It is also a halogen-free, environmentally friendly product.
Effect
■ Water-soluble paste
While conventional solder paste consists of rosin-based flux and cannot be cleaned with water, the residue from water-soluble flux can completely be removed with water alone.
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Before
AS2 (ref.)
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After
AS2 (ref.) After Cleaning w/water
※Note: The black part indicates the flux residue.
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Before
MF1 (Water-soluble)
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After
MF1 (Water-soluble) After Cleaning w/water
SEM images of solder after cleaned with pure water
■ Cleaning-free paste
Achieves good wettability and flux-residue-free (= no cleaning required) by developing a paste suitable for reflow in a formic acid atmosphere.
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Before
SEM Conventional paste
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After
SEM Cleaning-free paste
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Before
X-ray Conventional paste
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After
X-ray Cleaning-free paste
ADVANTAGE
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ADVANTAGE01
The water-soluble paste can reduce the cost of both the cleaning solution and liquid waste treatment cost.
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ADVANTAGE02
The cleaning-free paste also significantly reduces the process cost and tact time.
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ADVANTAGE03
Since no cleaning solution is used, contamination of the airtight package is suppressed.
OTHER SOLUTIONS
Other solutions for AuSn paste
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AuSn PASTE
Hope to flexibly change the thickness and shape of AuSn
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AuSn PASTE
Bond strength is not stable due to substrate roughness
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AuSn PASTE
The chip is misaligned when bonding
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AuSn PASTE
There are problems when using paste in mass production
Other related solutions
This solution utilizes
Mitsubishi Materials' AuSn paste.
