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Mitsubishi MaterialsElectronic Materials and Components

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Leading technology for Cu PillarPLATING

Green Actions Fine-pitch bumping on substrate side

Mitsubishi Materials offers the next-generation solder plating chemicals designed for cap sealing on Cu Pillar.

Cu pillar is one of the next-generation flip chip technologies. Mitsubishi's plating chemicals are also applicable for Cu pillar. In addition, our plating chemicals are ideal for fine pitch application.

Cu Pillar applicable for fine pitch
Green Actions Fine-pitch bumping on substrate side