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Mitsubishi MaterialsElectronic Materials and Components

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Physical PropertiesAuSn PASTE

Automatic control over bonding direction in mounted devices by self-alignment Water-soluble AuSn Paste: Able to clean the flux residue using only water after reflow

Gold-tin alloy is Au-20wt%Sn with a eutectic of 280C (melting point) and Au-90wt%Sn with a eutectic of 217C (melting point).

Physical Properties

Particularly Au-20wt%Sn has excellent electricity and thermal conductivity.
Au-20wt%Sn alloy and Au-22wt%Sn alloy are considered to have no big difference between in the physical properties mentioned above.

Composition
(wt%)
Melting
Temperature
Mechanical Properties Physical Properties Specific
gravity
Solidus
Curve
()
Liquidus
Curve
(℃)
Tensile
Strength
(kg/mm2)
Extension
(%)
Hrdness
(Hg)
Thermal
expansivity
(×10-6/℃)
Thermal
conductivity
(W/m·K)
Electric
conductivity
(IACS%)
Au 1,063 1,063 13.3 45 25 14.2 311 75 19.3
Au-20Sn 280 280 29.0 - 118 17.5 57.3 8.0 14.52
Au-90Sn 217 217 6.4 2 16 13.6 - 11.2 7.78
Au-12Ge 356 356 19.0 - 108 12.0 44.4 - 14.67
Au-7.4Ge 356 680 - - 82 13.1 - 7.1 16.16
Au-3.15Si 363 363 26.0 - 86 14.9 - - 15.7
Au-2Si 363 760 - - 65 13.9 - 15.8 16.85
Pb-63Sn 183 183 4.9 - 17 24.7 49 11.9 8.42
Pb-5Sn 310 315 9.5 26 8 28.7 23 8.8 11.0
Sn-3.5Ag 221 221 2.0 73 40 - 33 14.0 7.36

Au-Sn Phase Diagram

Atomic Percent Tin
Automatic control over bonding direction in mounted devices by self-alignment Water-soluble AuSn Paste: Able to clean the flux residue using only water after reflow