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Mitsubishi MaterialsElectronic Materials and Components

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AuSn paste for thin film formation as a the substitute of sputtering depositionAuSn PASTE

Automatic control over bonding direction in mounted devices by self-alignment

Paste printing method can easily form AuSn alloy thin film.

AuSn paste goes onto the necessary spots, and AuSn thin film forms easily by reflow. With appropriate stencil mask and paste specifications, the AuSn films can be as thin as under 5μm.

Cross section picture of AuSn thin film (4 μm) gained by paste printing method
Automatic control over bonding direction in mounted devices by self-alignment
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