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Electronic Materials and Components

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Automatic control over bonding direction in mounted devices by self-alignmentAuSn PASTE

AuSn paste for thin film formation as a the substitute of sputtering deposition Physical Properties

High liquidity in melting AuSn produces a self-alignment effect.

AuSn paste creates bonding with self-alignment effect, which Ag epoxy resin paste is not capable of.

Example

AuSn paste for thin film formation as a the substitute of sputtering deposition Physical Properties