Go to the body of the page

Mitsubishi MaterialsElectronic Materials and Components

Contents start

Automatic control over bonding direction in mounted devices by self-alignmentAuSn PASTE

AuSn paste for thin film formation as a the substitute of sputtering deposition Physical Properties

High liquidity in melting AuSn produces a self-alignment effect.

AuSn paste creates bonding with self-alignment effect, which Ag epoxy resin paste is not capable of.

Example
AuSn paste for thin film formation as a the substitute of sputtering deposition Physical Properties
This website uses cookies to collect information about your browsing history for improving user experience and for marketing activities. Before using this website, please agree to the use of cookies by pressing the button at the bottom.
You can change settings at the "Collection of browsing history" section on the "Site Policy" webpage.
Agree and close