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Gold-tin (AuSn) alloy solder paste

Applications

  • Die bonding (high brightness LEDs, peltier elements and power semiconductors) for vehicle installations, lightings, thermoelectric exchange modules and others .
  • Sealing (crystal devices and SAW devices) for mobile communications, base stations, MEMS sensors and others.

Advantages

  • Lower cost by batch processing of printing and reflow (heat-treatment)
  • Available for dispensing and pin transfer
  • Excellent wettability
  • Capable of bonding small parts which is not easy with preform foil materials.
  • No high cost for metal molds
  • Higher thermal conductivity and bond strength than those of thermosetting Ag epoxy resin
  • Easily able to form electrode bumps
  • New paste that is environmentally friendly (Water-soluble paste, Cleaning-free paste)NEW!

Product Line-up

Supplying
Method
Composition Particle sizeFlux type viscosity Gas type during reflow
Printing Au78/Sn22 16-53um
16-32um
<32um
5-16um
MSN
RA(AS2, AS3)
Water solubleNEW!
180–300Pa·s N2
<11um RA(AS2, AS3) 20–50Pa·s N2
Dispensing 5-16um
16-32um
RMA(AS1)
RA(AS2)
Water solubleNEW!
50–130Pa·s N2
Cleaning freeNEW! formic acid+N2
Pin transfer <11umRA(AS2) 10–50Pa·s N2
Cleaning freeNEW! formic acid+N2

· For any other combinations of alloy composition, particle size and flux type, please contact us

Documents

No documents, now.

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