Gold-tin (AuSn) alloy solder paste

Applications

• Die bonding (high brightness LEDs, peltier elements and power semiconductors) for vehicle installations, lightings, thermoelectric exchange modules and others .
• Sealing (crystal devices and SAW devices) for mobile communications, base stations, MEMS sensors and others.

Advantages

• Lower cost by batch processing of printing and reflow (heat-treatment)
• Available for dispensing and pin transfer
• Excellent wettability
• Capable of bonding small parts which is not easy with preform foil materials.
• No high cost for metal molds
• Higher thermal conductivity and bond strength than those of thermosetting Ag epoxy resin
• Easily able to form electrode bumps
• New paste that is environmentally friendly (Water-soluble paste, Cleaning-free paste)

Product Line-up

Supplying Method	Composition	Particle size	Flux type	viscosity	Gas type during reflow
Printing	Au78/Sn22	16-53um 16-32um <32um 5-16um	MSN RA(AS2,　AS3) Water soluble	180–300Pa·s	N2
		<11um	RA(AS2,　AS3)	20–50Pa·s	N2
Dispensing		5-16um 16-32um	RMA(AS1) RA(AS2) Water soluble	50–130Pa·s	N2
			Cleaning free		formic acid＋N2
Pin transfer		<11um	RA(AS2)	10–50Pa·s	N2
			Cleaning free		formic acid＋N2

· For any other combinations of alloy composition, particle size and flux type, please contact us

Links for Details

• AuSn solder paste for thin film formation as the substitute of sputtering and deposition
• Automatic control of bonding direction of mounted devices using self alignment
• Physical properties and phase diagram
• Water-soluble AuSn Paste: Able to clean the flux residue using only water after reflow

Documents

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