HOME » Products » Fine Materials for Assembly » Gold-tin (AuSn) alloy solder paste
Supplying Method |
Composition | Particle size | Flux type | viscosity | Gas type during reflow |
---|---|---|---|---|---|
Printing | Au78/Sn22 | 16-53um 16-32um <32um 5-16um | MSN RA(AS2, AS3) Water soluble ![]() |
180–300Pa·s | N2 |
<11um | RA(AS2, AS3) | 20–50Pa·s | N2 | ||
Dispensing | 5-16um 16-32um | RMA(AS1) RA(AS2) Water soluble ![]() |
50–130Pa·s | N2 | |
Cleaning free![]() |
formic acid+N2 | ||||
Pin transfer | <11um | RA(AS2) | 10–50Pa·s | N2 | |
Cleaning free![]() |
formic acid+N2 |
· For any other combinations of alloy composition, particle size and flux type, please contact us
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