News
- Announcement of Exhibiting at electronica 2026 (in Munich, Germany, from November 10 to November 13)
- Notice of Discontinuation of Manufacturing and Sales of DSA-Related Series
- Mitsubishi Materials Corporation to Exhibit at the 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Booth #409
- Notice of Renewal of ”Precision Silicon Products”
APPLICATION
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PRODUCTS
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Products
We introduce unique, high-value products that make use of the materials produced by our group.
- Precision Silicon Products
- Rectangle Silicon Panel
- Gold-tin (AuSn) Alloy Solder Paste
- Sol-Gel Solutions
- Low Alpha Solders
- NTC Thermistors
- Thermistor Sensors
- Surge Absorbers
- Columnar Crystal Silicon
- Perfluoroalkylsulfonyl Compounds
- Transparent Conductive Materials
- White Electro-conductive Materials
- Insulation Black Pigment
- Solar Heat-ray Shielding
- Seal Products
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DA53 Series
The DA53 Series has a micro-gap cut to an accuracy of several tens of microns for rapid response against induced lightning and electrostatic discharges.Ideal for protecting power supplies from power-line surge voltage.

Gold-tin (AuSn) Alloy Solder Paste
Mitsubishi Materials' Gold-tin(AuSn) alloy paste offers high process flexibility.

New KH05 Series
The KH Series are wire-bondable flake style NTC Thermistors

Precision Silicon Products
We manufacture internal parts primarily for semiconductor front-end processing equipment from crystalline silicon ingots. Please consider our high-purity silicon processed products as reduction of metal contamination on wafers, particle countermeasures, heat-resistant parts, and chemical-resistant parts.
