Ultra Low Alpha Plating Chemicals
Mitsubishi Materials offers Ultra Low Alpha Plating Chemicals with long years of achievements for bumping applications.
Useful informationFeatures
- Superior stability
- Plating at high deposition rate
- Minimal variations in bump height and composition
- Allows a stable quality in combination with our plating anode products
Product Line-up
Plating Chemical for Wafer side
| Product name | Deposition rate (μm/min) |
Chemistry type | |
|---|---|---|---|
| Lead free Plating Chemicals | |||
| Tin-Silver | TS-140 | –2 | Standard type |
| TS-202 | 2–7 | High speed type | |
| TS-140HS | 3.5–7.5 | ||
| TS-520 | 3.5–7.5 | High speed type (environment-responsive) |
|
| Tin | TVF-180 | –7.5 | Standard type |
| Tin-Lead Plating Chemicals | |||
| Eutectic | MX-M03069-574A1 | –2 | Standard type |
| High Lead | MX-M07013-571D6 | 1.5–7.5 | High speed type |
| Cu plating chemical | |||
| W25 | ～4 | High speed type |
Plating Chemical for Substrate side <Under Development>
| Product name | Deposition rate (μm/min) |
Chemistry type | |
|---|---|---|---|
| Sn Plating Chemical | |||
| TF-100 | 0.5–1 | Filling type |
MULαS
"MULαS series" is low alpha products which Mitsubishi Materials has been offered to customers for over 30 years.
MULαS series (Low alpha solders)
Major semiconductor package types in high pin count , high speed and high end applications, such as micro processor unit(MPU), graphic processor unit(GPU), SRAM etc., have advanced from wire-bonded package to flipchip package which employs solder bump electrodes. (refer to Fig. structure of FC-BGA)However, flipchip package is especially sensitive to "Soft Errors," errors in IC memory data caused by radiation such as cosmic ray and alpha particles which is emitted from semiconductor materials and environment; therefore reduction of alpha emission in packaging materials has become a critical issue.
For over 30 years, MMC has been specialized in various solder materials. Our principal behind this development always has been to prevent soft error in chips by reducing alpha ray emission from the materials. So we can offer low alpha products called "MULαS series" to our customers.
Concept
On MULαS series, utilizing the evaluation, control, and manufacturing technology of low-alpha materials acquired over the years, MMC strives for following commitments.
- Provide strongly low-alpha guaranteed products.
- To challenge and offer the evaluation and manufacturing technology for further lower alpha emission materials.
- To offer the most advanced bumping process (printing, plating, etc.)
- To support Customers' process to lowering alpha emission.
Useful information