Low Alpha Anode
Mitsubishi Materials customizes the shapes and compositions of the anode, depending on the various types of plating tools.
Application of Low Alpha Anode
Low Alpha Anode is utilized to replenish metal elements in bump plating process.
Strengths of Low Alpha Anode
- Alpha-particle emission amount: 0.002cph/cm2
- Uniform and fine grain size help achieve stable plating with its excellent solubility.
- High purity of more than 99.99%
- Comes in various shapes and each has high processing accuracy (Disk, Ring, Pellet, etc.)
- No use of conflict minerals.
- Combined with our plating chemicals, our low alpha anode ensures even better performances.
Product Line-up
| Pb-Sn | Sn | Cu | |
|---|---|---|---|
| Composition | Pb-63%Sn Pb-5%Sn |
100%Sn | Cu (P including) |
| Shape | Disk Ring |
Disk Ring Pellet |
Disk |
| Purity | ≤99.99% | ||
| Alpha-particle emission | <0.01cph/cm2 <0.002cph/cm2 |
<0.002cph/cm2 | |
| Intended wafer size | 8 inch 12 inch |
||
MULαS
"MULαS series" is low alpha products which Mitsubishi Materials has been offered to customers for over 30 years.
MULαS series (Low alpha solders)
Major semiconductor package types in high pin count , high speed and high end applications, such as micro processor unit(MPU), graphic processor unit(GPU), SRAM etc., have advanced from wire-bonded package to flipchip package which employs solder bump electrodes. (refer to Fig. structure of FC-BGA)However, flipchip package is especially sensitive to "Soft Errors," errors in IC memory data caused by radiation such as cosmic ray and alpha particles which is emitted from semiconductor materials and environment; therefore reduction of alpha emission in packaging materials has become a critical issue.
For over 30 years, MMC has been specialized in various solder materials. Our principal behind this development always has been to prevent soft error in chips by reducing alpha ray emission from the materials. So we can offer low alpha products called "MULαS series" to our customers.
Concept
On MULαS series, utilizing the evaluation, control, and manufacturing technology of low-alpha materials acquired over the years, MMC strives for following commitments.
- Provide strongly low-alpha guaranteed products.
- To challenge and offer the evaluation and manufacturing technology for further lower alpha emission materials.
- To offer the most advanced bumping process (printing, plating, etc.)
- To support Customers' process to lowering alpha emission.