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Mitsubishi Materials Corporation ("MMC") has developed a "square silicon substrate," one of the world's largest rectangular-shaped silicon substrates that achieves high flatness and low surface roughness.

Next-generation semiconductor packages that employ chiplet technology, which has been attracting attention in recent years, are becoming increasingly larger, with sizes now up to about 100 mm square. In the semiconductor package manufacturing process, there is a problem with wafer-level packages (WLPs) that use a conventional 300 mm-dia. silicon wafer, etc. as a carrier substrate onto which semiconductor chips are placed. The problem is that packages cannot be efficiently fitted onto the wafer substrate because of the small area and circular shape of the wafer.

To solve this problem, MMC has developed a large-area, rectangular-shaped "square silicon substrate" by combining the casting technology for large silicon ingots, which the MMC Group has developed over many years, with MMC's proprietary processing technology.
This "square silicon substrate" will contribute to improving productivity in the semiconductor field in several ways including its use as a carrier substrate in the semiconductor manufacturing process and its application as an interposer material for semiconductor packages.