Mitsubishi Materials Corporation

AuSn Paste

AuSn Paste

Electronic Materials & Components

Features

AuSn Paste allows the AuSn alloy to be utilized flexibly according to the customers needs. AuSn Paste also has as a high thermal conductivity and high reliability

Application Examples

Die bonding material (LED device, Peltier device), sealing material (UV LED, crystal / SAW device)

Contact

Advanced Products Company Electronic Materials & Components Div. Sales Dept. Electronic Materials Group

TEL:+81-3-5252-4460

Contact Us Via Email

Related Websites

Advanced Products Company Electronic Materials & Components Div. Electronic Materials Dept.

https://www.mmc.co.jp/adv/ele/en/products/assembly/ausn.html

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