2014
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Investor Meeting Material for the 1st Half of the fiscal year ending March 31, 2015(1.4MB)
Consolidated Financial Results for the Six Months Ended September 30, 2014(267KB)
Notice Regarding Discrepancies between Consolidated Forecasts and Actual Results (Six Months Ended September 30, 2014)(50KB)
Mitsubishi Materials & SCREEN Semiconductor Solutions First in the MEMS Industry to jointly develop a Mass Production Technology for PZT Films Attains a productivity more than two times higher than conventional products
The Metals Production Plans in the 2nd Half of the fiscal year ending March 31, 2015(27KB)
Share purchase agreement for Hitachi Tool Engineering, Ltd.(86KB)
Development of smallest-class surge absorber for power supply
Consolidated Financial Results for the Year Ended March 31, 2014(224KB)
First in the Japanese salt industry to acquire Halal Certification
E-Scrap Recycling Business Department newly established in the U.S.A.
Announcement for restarting operations at Yokkaichi Plant
Notice of the Resolutions of the 89th Ordinary General Meeting of Shareholders(35KB)
Final Report by the Accident Investigation Committee for the Explosion & Fire Accident occurred at Yokkaichi Plant
Business Report and Financial Statements(302KB)
Notice of the 89th Ordinary General Meeting of Shareholders(63KB)
Long-term Management Policy and Medium-term Management Plan (FY2015-2017)(4.1MB)
Consolidated Financial Results for the Year Ended March 31, 2014(396KB)
Announcement regarding the establishment of the “long-term management policy” and medium-term management plan (FY2015-2017) “Materials Premium 2016 – Challenge to become the world's leading businesses group”(188KB)
Interim Report by the Accident Investigation Committee for the Explosion & Fire Accident occurred in the High-Purity Polycrystalline Silicon Manufacturing Facility at Yokkaichi Plant of Mitsubishi Materials Corporation(Abridged Version)
The Metals Production Plans in the 1st Half of the fiscal year ending March 31, 2015(71KB)
Development of high-performance insulated circuit substrate “DBA substrate with Ag fired film” for next-generation power modules
Ikuno Plant has received certificate of CFS (conflict-free smelter) for tin(Sn) from EICC
Development of the world's thinnest flexible thermistor sensor
Consolidated Financial Results for the Nine Months Ended December 31, 2013(320KB)
Report Number 3; Explosion and Fire at Yokkaichi Plant
MMC Superalloy Corporation merges with Hitachi Metals, Ltd.
Report Number 2; Explosion and Fire at Yokkaichi Plant
Establishment of an Accident Investigation Committee for the Accident at Yokkaichi Plant
Temporary Suspension of Operations at Yokkaichi Plant
Explosion and Fire at Yokkaichi Plant