Copper Anodes (Copper Balls)
for Plating

Copper Anodes (Copper Balls) for Plating

Features

An extremely stable composition, structure and format thanks to a proprietary integrated manufacturing process has earned Mitsubishi Materials' copper anodes a top market share at home and abroad.

Application Examples

Anodes for through-hole plating of various printed circuit boards, underplating of lead frames

[High quality copper anodes]

Contact

Advanced Products Company Copper & Copper Alloy Business Unit Extruded Product & Wire Rod Sales Dept.

TEL：+81-3-5252-5334

Related Websites

Advanced Products Company Copper & Copper Alloy Business Unit

http://www.mitsubishi-copper.com/en/products/processing/copper_ball/