News

April 24, 2026

Mitsubishi Materials Corporation

Mitsubishi Materials Corporation to Exhibit
at the 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Booth #409

Mitsubishi Materials Corporation is thrilled to announce our participation in the 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), alongside our subsidiary, Mitsubishi Materials U.S.A. Corporation. This premier international event will be held in Orlando, FL, from May 26 to May 29, 2026.

At the exhibition held in conjunction with this conference, our group will showcase a wide range of products and technologies for the semiconductor industry under the theme:
"For people, society, and the earth, circulating resources for a sustainable future."

Key highlights include:

Low Alpha Pb-Free Solder Plating Solution and Anode: We will present our latest low alpha Pb-free solder products for various bump formations (Sn and SnAg for C4 bump, and micro bump). Solder bump plating plays a crucial role in advanced packaging, and Mitsubishi Materials leads the industry with over 20 years of experience, commanding over 60% of the global market share!

KAKUGATA™: We will exhibit "KAKUGATA™," a large rectangle silicon panel for which a trademark application has recently been filed, and which is expected to contribute to improved productivity in panel-level packaging.

Metal Matrix Composites: We will showcase metal matrix composite materials as heat dissipation components for advanced packaging, where heat generation is rapidly increasing in the AI era.

Nanoporous Cu Plating: We will introduce our latest technological innovations in nanoporous Cu plating technology for next-generation advanced interconnections.

Visit our booth #409 to engage with our experts and learn more about our contributions to the future of electronic components and technology. For additional information and conference registration, please visit the IEEE ECTC website.

2026 IEEE 76th Electronic Components and Technology Conference

About ECTC - ECTC

Mitsubishi Materials Booth #409

CONFERENCE & EXHIBITION LOCATION:

JW Marriott & The Ritz-Carlton Grand Lakes Resort
4040 Central Florida Parkway, Orlando, Florida, USA 32837

EXHIBITION HOURS:

Wednesday, May 27/ 9:00am - 12:30pm, 2:00 - 6:30pm
Thursday, May 28/ 9:00am - 12:30pm, 2:00 - 4:00pm

ECTC
(Click the picture to see the enlarged image)

End

<Contact details for inquiries>

Corporate Communications Dept.
+81-3-5252-5206