MULαS Series
Major semiconductor package types in high pin count , high speed and high end applications, such as micro processor unit, graphic processor unit, SRAM etc., have advanced from wire-bonded package to flipchip package which employs solder bump electrodes. (refer to Fig.1 structure of FC-BGA)However, flipchip package is especially sensitive to “Soft Errors,” errors in IC memory data caused by radiation such as cosmic ray and alpha particles which is emitted from semiconductor materials and environment; therefore reduction of alpha emission in packaging materials has become a critical issue.

Fig1 Structure of FC-BGA
For over 20 years, MMC has been specialized in various solder materials. Our principal behind this development always has been to prevent soft error in chips by reducing alpha ray emission from the materials. While the IC packaging changed its design continuously, the form of solder materials has also transformed dramatically from ribbon to bump forming materials.
Concept
On MULαS series, utilizing the evaluation, control, and manufacturing technology of low-alpha materials acquired over the years, MMC strives for following commitments .
  • provide strongly low-alpha guaranteed products.
  • To challenge and offer the evaluation and manufacturing technology for further lower alpha emission
    materials.
  • To offer the most advanced bumping process (printing, plating, etc.)
  • To support Customers' process to lowering alpha emission.
New LOGO
MULαS Logo MULαS Emblem
Bumping methods and product groups.
Table 1 : Bumping Process and MMC's Product Name
Solder Bumping
Process		 Product Name Characteristics Pb/Sn
system		 Pb free
system
Plating ULA/SULA Liquid High through-put, Fine pitch Yes Yes
ULA Solder Anode Yes N/A
Printing LA/ULA/SULA Solder paste High through-put, Fine pitch, Low cost Yes Yes

Introduction of Products

  1. Alpha Grade of MULαS Series
  2. ULA/SULA Plating Chemical and Solder Anode (for Plating Process)
  3. Low Alpha Solder Paste(Printing Process)

| Low alpha solder is the solution for soft-error in bumping | Gold alloy ribbon and pellets |
| Cladded Materials | Fine-fabricated material (Photo-etching fabricated materials)|

                   


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