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TiW Sputtering Target

Performance as a barrier layer

TiW is a key material that is widely used as a barrier metal layer in semiconductor field because of its high melting point.

Advantages of TiW target from Mitsubishi Materials

Tungsten powder, which is one of raw materials for TiW targets, is manufactured at one of our group companies, therefore we are able to provide and keep the stable supply.

  • High purity, High density, Fine structure
  • Capable of adjusting Ti content
  • Available in large size *Φ450mm

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