FH05/FH10 SERIES

Dimensions (mm)

Spec

• Operating temperature range・・・・・・・・・・・
-40℃~+125℃
• Heat dissipation ・・・・・・・・・・・・・・・・・・・・・・・
(FH05):0.15mW/℃
(FH10):0.3mW/℃
 
• Maximum power dissipation・・・・・・・・・・・・
(FH05):15mW
(FH10):30mW

*Heat dissipation and Maximum power dissipation are for thermistor soldered to φ0.1mm CuNi wire.

Features

•Extremely small and precise
•Long-life reliability
•Excellent solderability, bondability
•Excellent stability against AuSn soldering process (about 300℃)

Characteristics

FH05, FH10 Series

Type
Resistance
R25
Resistance Tolerance
B Value
B25/50
B Value
R-T DATA
±1%
±2%
±3%
PDF CSV
FH05-6D103*C
10kΩ
3,930K
FH10-6E103*C
10kΩ
3,950K
FH10-6Q103*C
10kΩ
3,410K
FH10-3U104*C
100kΩ
3,950K

Recommended Soldering Profile

FH Series Au/Sn Solder mounting
Solder:Au/Sn(79/21)Preform
Mounting device : Die bonder
N2 flow : 3L/min
Mounting Temperature : 320℃

 

1) Please keep exposure to temperature exceeding 280℃ to under 10seconds.
2) After soldering,do not force cool,allow the parts to cool gradually.

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