FH SERIES

Dimensions (mm)

 

Series
L
W
T
VH02
0.21±0.03
0.21±0.03
0.2 max
FH05, VH05
0.32±0.05
0.32±0.05
0.2 max
FH10
0.55 or 0.60±0.05
0.55 or 0.60±0.05
0.3 max
VH10, LN10
0.60±0.05
0.60±0.05
0.3 max

FH05series

• Resistance tolerance ・・・・・・・・・・・・・・・・・・・
±1%±2%±3%(R25)
• B value tolerance・・・・・・・・・・・・・・・・・・・・・・・
±1%(B25/50)
• Operating temperature range・・・・・・・・・・・
-40℃~+125℃
• Heat dissipation ・・・・・・・・・・・・・・・・・・・・・・・
0.15mW/℃
• Maximum power dissipation・・・・・・・・・・・・
15mW

Features

•Small precision type
•Long-life Reliability
•Excellent solderability,bondability
•Excellent stability against Au/Sn soldering process(about 300℃)

Characteristics

Type
Resistance
R25
Resistance Tolerance
B Value
B25/50
R-T DATA
±1%
±2%
±3%
PDF CSV
6D103*C
10kΩ
3,930K

FH10series

• Resistance tolerance ・・・・・・・・・・・・・・・・・・・
±1%±2%±3%(R25)
• B value tolerance・・・・・・・・・・・・・・・・・・・・・・・
±1%(B25/50)
• Operating temperature range・・・・・・・・・・・
-40℃~+125℃
• Heat dissipation ・・・・・・・・・・・・・・・・・・・・・・・
0.3mW/℃
• Maximum power dissipation・・・・・・・・・・・・
30mW

Features

•Small precision type
•Long-life Reliability
•Excellent solderability,bondability
•Excellent stability against Au/Sn soldering process(about 300℃)

Characteristics

Type
Resistance
R25
Resistance Tolerance
B Value
B25/50
R-T DATA
±1%
±2%
±3%
PDF CSV
6E103*C
10kΩ
3,950K
6Q103*C
10kΩ
3,410K
FH10-3U104*C
100kΩ
3,950K

Recommended Soldering Profile

FH、VH、LN Series Au/Sn Solder mounting
はSolder:Au/Sn(79/21)Preform
Mounting device : Die bonder
N2 flow : 3L/min
Mounting Temperature : 320℃
1) Please keep exposure to temperature exceeding 280℃ to under 10seconds.
2) After soldering,do not force cool,allow the parts to cool gradually.
3) Please contact us about scrubbing procedures.

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