Research and Development

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Constantly Taking on Challenges of Technological Innovation Deriving from Our Materials Technologies

The Mitsubishi Materials Group aims to contribute to people, society and the Earth through application of its unique technologies. We aim to create products and technologies that distinguish our Group and enable us to win out in the global materials market, as well as propelling us forward to become a leading corporate group.

Business Summary

Our headquarters Technology Development Department and the Central Research Institute form the hub for development activities, which interact closely with our business departments.

Research building
Organization chart of Research department

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Targets and Strategy

Our fundamental policy for technological development is to accurately identify customer needs and future technology trends, and develop and supply distinguishing products and technologies in a timely manner.
We maintain close ties with our Business Strategy Department and individual businesses' marketing departments, conduct technology exchanges with customers and participate in trade shows as part of our proactive developmental marketing activities. To remain a development leader even as times change, we recognize the importance of interacting directly with customers.
In addition, to provide new proposals that accurately meet customers' needs, we are pursuing the “Materials Premium,” meaning the generation of special synergies as an integrated business entity from the Mitsubishi Materials Group's collective materials, processing and recycling technologies, as well as the people in charge of them.

Technology development strategy

In the short term, we aim to become the leader and stand out in each of our businesses by generating unique new products and technologies in a timely manner. Over the medium term, we will address next-generation needs in our fields of focus: automotive, electronics, energy, and the environment and recycling, developing new businesses into core operations. Long-term, we will take on new R&D challenges to boldly develop promising future technologies.

The field of making efforts

Even though we are uncertain about how the business environment will look five years in the future, we are working on our capability to offer new choices that will lead to future developments in various fields of business. To this end, we have launched ‘Materials Premium 2016,’ a medium-term management plan and are reinforcing new business development.

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Topics

Developing the World's Thinnest Flexible Thermistor Sensors

World's thinnest flexible thermistor sensor World's Thinnest Flexible Thermistor Sensor

Flexible and less than 100µm in thickness, we have developed the world's thinnest flexible thermistor sensors (sensors used in temperature detection). Thermistor sensors are used in smartphones, personal computers and other electronic devices, as well as air conditioners, other home electronics and automobiles. In recent years, demand has grown for sensors that are more compact and thinner and that respond more swiftly to temperature changes. In the past, making thermistors that satisfy all these demands, as well as being flexible, has been problematic. The new thermistors should find application in mobile devices, where spaces are tight, as well as on curved surfaces.

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History

Mining research institute (At its start)Mining Research Institute (At its start)

Mining research institute (At the time of moved to Omiya)Mining Research Institute
(At the time of moved to Omiya)

In 1917, Mitsubishi Goshi Kaisha established the predecessor to today's Central Research Institute. Named the Mining Research Institute, this was Japan's first civilian research institute.
In 1939, the institute relocated to the city of Omiya, Saitama Prefecture. One of Japan's most preeminent research institutions for nearly a century, the Central Research Institute has engaged in research and development centered on materials and processes. Fields of application are diverse, including resources, energy, raw materials, basic materials, new materials, various types of products and even recycling. The institute generates synergies by making connections among these genres.
In 2001, we commemorated the dawning of a new century by constructing a new research wing in the city of Naka, Ibaraki Prefecture, and began a transition process that was completed in 2007. This year marked the relaunch of the Central Research Institute, operating branches in three regions: Onahama, Kitamoto and Omiya.

1917 Established in Shinagawa, Tokyo, as the Mining Research Institute
1939 Relocated to the city of Omiya, Saitama Prefecture (now Omiya-ku, Saitama)
1964 Expanded fields of research, changed name to Central Research Institute
1967 Visited by the Showa Emperor and Empress
1995 Conducted organizational restructuring, changed name to the Sogo Kenkyujo
2001 Established the Omiya Research Center and the Naka Research Center within the Sogo Kenkyujo
2007 Conducted organizational restructuring, changed name to the Central Research Institute

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R&D Review

No.4 2015 Special Feature: Metallic Materials

R&D Review No.4 Cover PageR&D Review No.4 Cover Page

Special Feature: Metallic Materials

  • Preface Flexibility in Discussion on the Various Properties of Metallic Materials
  • The Relation between Crystalline Texture and Etching Rate on Copper
  • Influence of Ca on the Interface between Cu Film and SiO2Layer
  • Grain Refinement of Cu-Zn-Ni-Mn Castings by Addition of Ti and P
  • Special Grain Boundary Formation of Cu Alloys
  • Properties of High-concentration Cu-Mg Solid-solution Alloys as Materials for Terminals
  • Numerical Analysis for Double Seaming Process of Beverage Can
  • Predictions of Texture Evolution and Mechanical Properties by Crystal Plasticity
  • Practical Evaluation of Reactor with Powder Magnetic Core

No.3 2014 Special Feature :Sintering and Bonding Technology

R&D Review No.3 Cover PageR&D Review No.3 Cover Page

Special Feature :Sintering and Bonding Technology

  • Preface Designing Materials from the Ground Up: Revealing the dopant "spice"in materials development
  • Mechanical Properties and Wear Resistance on Granite of Non-metal Binder Thermally Stable Polyerystalline Diamond(TSP)
  • The Bonding Structure of the Various High Purity or Binderless Polycrystalline Cubic Boron Nitride Compacts Sintered at 5 to 7 GPa and 1600 to 2000°C
  • cBN Tools and Wear Mechanism in the Turning of Hardened Steel
  • Development of Back-electrods for Thin Film Si Solar Cell Using Wet-coating Materials
  • Development of DBA Substrates with Heat-sink
  • New Power-module Structures Consisting of Both Cu and AI Bonded to AIN Substrates with an AI Base Plate
  • Development of DBA Substrates with Sintered Silver Layer for Die-bonding
  • Atomic-scale Characterization of Aluminum/Ceramics lnterfaces by TEM (Transmission Electron Microscope)

No.2 2013 Special Feature :Thin Film Technology

R&D Review No.2 Cover PageR&D Review No.2 Cover Page

Special Feature :Thin Film Technology

  • Preface Fun and Wonder of thin Film World
  • Coating Technology of CDV-Al2O3,for Coated Cemented Carbides
  • Technology of Hard Thin Films by using Physical Vapor Deposition with Arc lon Plating System
  • Technology of the Diamond Coating on Cemented Carbides
  • Development of Ultra Thin Film Flexible Thermistor with Reactive Sputtering Method
  • Film Formation Technology of Function Film by Electrodeposition
  • Deposition Technique of Ferroelectric Thin Films by Using Sol-Gel Method
  • Fabrication of High Quality Ag Alloy Film by Sputtering Method
  • Compositional Design of Functional Oxide Films with Co-evaporation Technique

No.1 2012 Special Feature :Overview of Central Research lnstitute

R&D Review No.1 Cover PageR&D Review No.1 Cover Page

Chapter1 Creating raw materlals

  • History and forecast on research and development for smelting,refning and recycling process
  • Functional Materials Supporting Electronics and Energy Technologies
  • Alloy design and development

Chapter2 Enhancing functions

  • Thin films and coatings technologies for high efficiency machining
  • Electronics Components Applied Fine Materials
  • Power electronics technology and material development
  • Development of High Performance Copper Aloy Strips Utiizing Plating Technique

Chapter3 Supporting output

  • Computer Aided Engineering (CAE) supporting process improvement and material design
  • Chemical Analysis Department and Materials Characterization Department

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