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Newly developed product - Solder paste made with ultra fine solder powder for pre-coating

Some electrode shapes can cause a deterioration coverage issue and it creates a connection error of BGA ball.
Our new paste made with ultra-fine solder powder for pre-coating is able to form flat and smooth solder layer regardless of the electrode shapes.

Solder paste forms flat and smooth solder layer
with high-perform coatability

Solder layer formed on quadrangular

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