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Characteristics of solder pastes

The narrower pitching become, the lower voiding as well as the better printing performance is demanded.
Our solder pastes feature not only its good printability but also excellent void performance. Such an excellent voiding performance is maintained even after multi-cycle reflow.

Flexible for fine pitch bumping

Bumping with 120μm pitch

Superior voiding performance

Voiding aspect through multi-cycle reflow (Photo by High resolution soft x-ray)

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