HOME »  Products »  Fine Materials for Assembly »  Gold-tin (AuSn) alloy solder paste

Gold-tin (AuSn) alloy solder paste

Applications

  • Die bonding (high brightness LEDs, peltier elements and power semiconductors) for vehicle installations, lightings, thermoelectric exchange modules and others .
  • Sealing (crystal devices and SAW devices) for mobile communications, base stations, MEMS sensors and others.

Advantages

  • Lower cost by batch processing of printing and reflow (heat-treatment)
  • Available for dispensing and pin transfer
  • Excellent wettability
  • Capable of bonding small parts which is not easy with preform foil materials.
  • No high cost for metal molds
  • Higher thermal conductivity and bond strength than those of thermosetting Ag epoxy resin
  • Easily able to form electrode bumps

Product Line-up

MethodAlloy
composition
Particle size
(µm)
Flux typeviscosity
(Pa·s)
PrintingAu-22wt%Sn16-53
16-32
5-16
MSN180–300
DispensingAu-22wt%Sn5-16AS150–130
Au-90wt%Sn16-32
Pin transferAu-22wt%Sn<11AS220–50

· For any other combinations of alloy composition, particle size and flux type, please contact us

Documents

No documents, now.

HOME PAGE TOP