HOME »  Products »  Fine Materials for Assembly »  Ultra Low Alpha Plating Chemicals »  Leading technology for Cu Pillar

Leading technology for Cu Pillar

Cu pillar is one of the next-generation flip chip technologies. Mitsubishi's plating chemicals are also applicable for Cu pillar. In addition, our plating chemicals are ideal for fine pitch application.

Cu Pillar applicable for fine pitch

backLeading technology for Cu Pillarnext