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Recyclable copper, essential for our common future. ETP, DHP, OF, and OF based copper alloy billets and cakes for your extrusion, forging, or rolling operation. ETP, DHP, OF, ETP based copper alloy, and OF based copper alloy wirerod for your wire drawing operation. Copper anodes for your plating operation

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Billet&Cake Wirerod Anodes

Mitsubishi Materials Oxygen Free Copper

Type Characteristic Product Application
1. MOF-OF ・No hydrogen embrittlement
・Low impurities
・Billet, Cake  
2. MOF for Electron ・No hydrogen embrittlement
・Low impurities
・Low oxygen content
・Billet, Cake
・Forged Parts
・Extruded Parts (Wire and Bar) 
・Electron Devices
・Gaskets
・High Temperature Electrode Welding
・Backing Plates
・Vacuum Environments
3. MOF for Magnetron ・No hydrogen embrittlement
・Low impurities
・Low oxygen & hydrogen content
・Low gas discharge in vacuum environment
・Billet
・Parts
・Forged or Machined
・Magnetron
・High Vacuum Environments
・High Voltage Electrodes
4. MOF for Superconductivity ・No hydrogen embrittlement
・Extremely low impurity content
・Residual resistively ratio (RRR) > 300 (>500)
・Billet
・Extruded Parts (Wire and Bar)
・Stabilizer for Superconductor (MRI)
5. MOF-SOF ASTM F68 Class 1

 

・No hydrogen embrittlement
・Extremely low impurity content
・Low oxygen & hydrogen content
・Low gas discharge in vacuum environment
・Ideal metal structure
・Billet, Cake
・Forged Parts
・Extruded Parts (Wire and Bar)
・Paricle Accelerators
・High Vacuum Environments
・High Voltage Electrodes

Upon request material with a residual resistivity ratio (RRR) of >500 can be supplied.


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