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Material for Backing Plates

Backing plates, sometimes called cooling plates, are used in thin film deposition (sputtering) processes in the manufacture of flat panel displays, architectural glass, and other applications. Backing plates are a critical component to the process and it is imperative that top quality high performance material from Mitsubishi Materials be used in the fabrication of these products.

We offer three specially designed materials for backing plates, each with it's own unique properties. "BP-1" has the strength necessary to resist arching yet still has excellent thermal conductivity. "BP-2" has many of the same features of molybdenum plates yet at a fraction of the cost. "BP-3" the highest quality oxygen-free copper for operations requiring OFC.

Mitsubishi Materials manufactures and supplies high performance backing plate material to your specific needs. Benefits of our material come from:

1. High Quality Copper Cathodes. Select copper cathodes with low impurity content are used for our oxygen-free copper and oxygen-free copper based alloys.
2. Advanced Continuous Casting Technology. Since 1965, we have produced oxygen-free copper and oxygen-free copper based alloy ingots using advanced control technology.
3. Strict Quality Control System. We maintain strict quality control using sophisticated inspection technologies.
4. Top Quality Research & Development. We have a major research & development center and can work with you to suggest changes and new designs for backing plates through simulation (stress analysis, strain analysis and thermal analysis of various materials, shapes, etc.).
5. The Mitsubishi Materials Network. Mitsubishi Materials has a large network of associated companies and can supply plate material for your production line as well as final products to your requirements as you need.

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