Mitsubishi Materials Group
Chinese
Japanese
Sitemap
Contact Us
Products
Automotive Products
Electronics Products
Semiconductor Materials
Electronic Materials
Electronic Components
Modules
Equipment Parts
Tools
New Materials
Green Products
Recycling
Products for solar cell
Construct Products
Precious Metals
Home
Products
Electronics Products
Back
Next
Heat Sink Materials (tungsten base, copper-tungsten base)
Advantages
High thermal conductivity (110-220W/mK). Low heat expansion coefficient (4-8ppm/K).
Keywords
Semiconductor heat sinks
Link
Back
Next
Site policy
Privacy policy
ChineseJapanese
Back
Site policy
Privacy policy
ChineseJapaneseSite policyPrivacy policy