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We make various materials and components used to build integrated circuits, including sputtering targets from polycrystalline silicon -- the starting point of semiconductor fabrication -- as well as gold bonding wire and lead frames.
Polycrystalline Silicon
Thin Film Forming Materials (MOCVD, Sol-Gel Solution)
Coating Diffusion Sources
Sputtering Targets for Semiconductor
Sputtering Target Materials (high-purity copper, high-purity copper alloys)
TAMAC194: Lead Frame Material
Fine Materials for Assembly
Precision Silicon Products
Low Alpha Solder (Paste, Balls, Anodes, Plating Chemicals)
Solder Balls and Solder Bars for Plating
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