Mitsubishi Materials Group ChineseJapanese
Mitsubishi Materials Corporation


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Semiconductor Materials
We make various materials and components used to build integrated circuits, including sputtering targets from polycrystalline silicon -- the starting point of semiconductor fabrication -- as well as gold bonding wire and lead frames.

  Polycrystalline Silicon
  Thin Film Forming Materials (MOCVD, Sol-Gel Solution)
  Coating Diffusion Sources
  Sputtering Targets for Semiconductor
  Sputtering Target Materials (high-purity copper, high-purity copper alloys)
  TAMAC194: Lead Frame Material
  Fine Materials for Assembly
  Precision Silicon Products
  Low Alpha Solder (Paste, Balls, Anodes, Plating Chemicals)
  Solder Balls and Solder Bars for Plating
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