Low Alpha Solder for Bum p Form ation
  1. Ultra low alpha available     0.002cph/cm2
  2. SULA grade exists for Lead free.
    Lower limit of detection level and no variation with time for alpha
  3. High Lead, Eutectic and Lead Free available
  4. Long life for continuous use (liquid and paste).
  5. Low void.
Products List
Name Process Composition
LA/ULA/SULA Liquid,  Solder Anode Plating High Lead, Eutectic, Lead free
LA/ULA/SULA Solder Paste Printing High Lead, Eutectic, Lead free
LA/ULA Ingot Evaporation Lead, Tin

Plating
ULA Liquid
Printing
ULA Solder Paste
After plated
Pb/Sn=95/5   Conc.60g/L		 After printing
Mask 0.10mmt, Opening 0.22mm
Typical alpha particle counts


Aging time (Days)
ULA solder paste (Eutectic)
Aging time (Days)
ULA Liquid (High-Lead)

Aging time (Days)
ULA/SULA solder paste (Lead free)


Sputtering  Target  for  UBM
  1. Fine grain size and low particle generation
  2. High purity


                   


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