Mitsubishi's assembly materials are widely used for advanced Products.
And Mitsubishi's precision-rolled fabrication products are the result of combining high-purity materials with our exclusive technology in an extremely clean environment, since the materials are melted, cast, rolled and fabricated by modern equipment installed in clean rooms under strict control.

Low alpha solder is the solution for soft-error in bumping   
This solder material has reduced alpha emission with a special refining process.
We prepare solder material indicated for all kinds of bumping
( Printing, Plating, ball mounting, evaporation)

Gold alloy ribbon and pellets
Gold alloy ribbon and pellets have enjoyed an excellent reputation in the high demand field of communication or space industry where they are widely used for sealing of ceramic package and die bonding for high frequency and opt-electronics devices.
Au-2%Si, Au-20%Sn, Au-12%Ge etc.

Cladded Materials
Cladded materials is a composite material with excellent properties which are not obtained in mono-material made by cladding technology.
Pt/Mo/Pt, Au/Ag/Au, Au/Ag etc.

Fine-fabricated material (Photo-etching fabricated materials)
Various forms of precision photo-etch fabrication can be applied to gold, silver , and their alloys.
These materials are widely used in different fields including semiconductor and space industry.