Gold-tin alloy solder

Use printing for mass production in ease.
No need for a Lid with solder perform.
This Gold-tin alloy make customer's sealing process change dramatically. and contributes to. cost reduction.

1. Characterization of Gold-tin alloy solder paste
  • The best use of sealing for SAW filter and crystal oscillator
  • Applicable to get a pure surface with low oxidation film
  • Applicable to form the bonding size range
    (Corresponding to diversification of size)
  • Applicable to mass production by printing
With a ribbon and a pellet, Ga-As dibond of the minimum size which cannot respond, and seam welding make sealing of a difficult package possible.


2. Wetability of Au-Sn(Gold-tin alloy) solder paste
Good wetability , cleans easily
No residual after cleaning
| Low alpha solder is the solution for soft-error in bumping | Gold-Tin alloy solder paste | Gold alloy ribbon and pellets |
| Cladded Materials | Fine-fabricated material (Photo-etching fabricated materials) |
                   


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