Electronic Materials Enterprise / Gold alloy ribbons, Pellets, Cladded materials, Fine-fabricated material

Gold alloy ribbons, Pellets

Mitsubishi's gold alloy solders have enjoyed an excellent reputation in the highly demanding fields of communication and the space industry where they are widely used for sealing of ceramic packages and die bonding for high frequency and opt-electronic devices.

1. Product line and their physical characteristic

System	Composition Wt%	Melting range		Hardness HB	Coefficient of thermal expansion 10^-6	Thermal line conductivity J/cm, S,	tensile strength N/mm²	Density
System	Composition Wt%	Solidus	Liquidus	Hardness HB	Coefficient of thermal expansion 10^-6	Thermal line conductivity J/cm, S,	tensile strength N/mm²	Density
Au-Sn alloy	Au/20Sn	280(Eutectic)		118	17.5	2.5	284	14.5
Au-Sn alloy	Au/90Sn	217(Eutectic)		16	13.6	-	63	7.8
Refference	Au	1063		25	14.2	-	131	19.3
	Au/3.15Si	363(Eutectic)		86	14.9	2.8	255	15.7
	Au/12Ge	356(Eutectic)		108	12.0	2.6	186	14.6
	Sn/3.5Ag	221	223	40	-	0.1	62	7.4
	Pb/63Sn	183(Eutectic)		17	24.7	0.5	48	8.5
	Pb/5Sn	274	314	8	28.7	0.4	93	11.1

2. Features

Minimum thickness is 10 micron. (Only Au/90Sn corresponds 30micron)
Minimum width is 0.2mm
Improving excellent wetability and remnant free surface.

3. Wetability of gold-tin alloy solder Improvement of gold-tin solder's wetability.
Conventional		Improved

4. Product

We are proud of meeting customer's requests for thinner and smaller products by supplying fine ribbons and pellets.

Typical dimensions
Ribbon : 10

0.3mmW

L
Pellet : 10

0.3mmW

0.3mmL

Cladded materials

Mitsubishi offers composite materials with excellent properties which are not obtained in mono-materials through cladding technology.

Typical dimensions
Pt/Mo/Pt 30

0.7mmW
Au/Ag/Au 23

0.5mmW

Fine-fabricated material (photo-etched fabricated materials)

Various forms of precision photo-etch fabrication can be applied to gold, silver and their alloys. These materials are widely used in different fields including semiconductor and space industry.

Application
Connecting materials for solar cell batteries.

| Low alpha solder is the solution for soft-error in bumping | Gold alloy ribbon and pellets |
| Cladded Materials | Fine-fabricated material (Photo-etching fabricated materials) |