1. Alpha Grade of MULαS Series

  LA Grade ULA Grade SULA Grade
Spec. Actual Spec. Actual Spec. Actual
Pb-Sn ≦1.0 < 0.3 Paste
(N-type)
≦0.02		 　0.01 N/A N/A
Paste
(E-type)
≦0.002 *1		 0.001 *1
Plating Chem.
≦0.02
(≦0.002 *1)		 0.002
(0.001 *1)
Lead-Free N/A N/A ≦0.01 　0.005 ≦0.005
(≦0.002 *1)		 0.001
(0.001 *1)
(unit：cph/cm2) *1 As plated film just after plating or as powder

2. ULA/SULA Plating Chemical and Solder Anode (for Plating Process)

2.1 ULA Liguid (Pb-Sn)

Characteristics

(1) Smooth surface bump
(2) Uniform bump height and Sn composition
(3) High speed plating
(4) Long usage bath life

(1) Outline of ULA Liquid (High speed plating type)

Type Name MX-M07013-571D6 MX-M05070-574A4
Alloy Pb/Sn = 95/05 Pb/Sn = 37/63
Total metal content 70 g/L 50 g/L
Cathode current density < 15 A/dm2 < 15 A/dm2
Bath temperature 30°C 30°C
Flow rate 20 L/min 20 L/min
Anode type Soluble/insoluble Soluble/insoluble

(2) Bump Appearance just after Plating

High Lead Solder Bump
ULA MX-M07013-571D6
Pb/Sn=95/5
Height:80μm, diameter:110μm, 7A/dm2		 Eutectic Solder Bump
ULA MX-M05070-574A4
Pb/Sn=37/63
Height:80μm, diameter:110μm, 7A/dm2

2.2 ULA Solder Anode (Only for Pb, Pb-Sn type)

Characteristics

(1) Low alpha plating process can be obtained by a combination of MMC's plating chemicals and anodes
(2) Applicable to various alloys and shapes   e.g. Pb, Sn, Pb-5%Sn, Pb-63%Sn (composition)
(3) Anodes can elongate the usage life of bath

2.3 SULA Liquid (Sn, Sn Solder)

Characteristic

(1) Smooth surface
(2) Uniform bump height and composition
(3) Long usage bath life
(4) Easy bath control
(5) High speed plating
(6) Applicable to major plater

Type Name TS-140
Alloy Sn/Ag = 97.5/2.5
Total metal content 50 g/L
Cathode current density < 5 A/dm2
Bath temperature 25°C
Flow rate 20 L/min
Anode type Insoluble
Lead-Free Solder Bump
SULA TS-140
Sn/Ag=97.5/2.5
Height: 80μm, diameter: 100μm, 4A/dm2
　・High-Speed SnAg Alloy Plating [SULA TS-202]
　・High-Speed SnCu Alloy Plating [SULA TC-007]
Characteristics

　・More than two times faster plating.
　・Long term stability

Type Name TS-202 TC-007
Alloy Sn/Ag = 97.5/2.5 Sn/Cu = 99.3/0.7
Total metal content 51.4 g/L 50 g/L
Cathode current density 5 - 10 A/dm2 5 - 10 A/dm2
Bath temperature 25°C 20°C
Flow rate > 20 L/min > 20 L/min
Anode type Insoluble Insoluble

Lead-Free Solder Bump
SULA TS-202
Sn/Ag=97.5/2.5
Height:60μm, diameter: 110μm, 7A/dm2		 Lead-Free Solder Bump
SULA TC-007
Sn/Cu=99.3/0.7
Height:30μm, diameter: 110μm, 7A/dm2


3. Low Alpha Solder Paste (Printing Process)

Characteristics

(1) Applicable to wafer bumping and interposer
(2) Applicable to 120μm bump pitch
(3) Low voids
Appearance(packaging)
(1) Composition

Alloy Composition
Pb-Sn Pb-5%Sn, Pb-10%Sn, Pb-63%Sn
Pb free Sn-2.3%Ag,
Sn-3%Ag-0.5%Cu
Sn-3.5%Ag-1%Cu
Sn-0.7%Cu etc.

(2) Powder Diameter

Solder Powder Diameter
2 - 12 μm (type 7)
5 - 15 μm (type 6)
15 - 25 μm (type 5)
10 -32μm etc.

(3) Flux Type

Flux Type
Activated Flus		 Flux Content Halogen Content
(HL) *
RA 5 - 15% 0.1<HL<0.5
RMA 0.02<HL<0.1
R HL<0.02
Non Halogen* 0
* Measurement method JIS Z 3124

(4) Example of Characteristic

Time variation of Alpha counts of ULA Solder Paste after reflow.(Pb-63%Sn)
・Lead Free Low Void Solder Paste for Bumping

Characteristics

　・Specially formulated flux optimized to reduce voids.
　・Offer the optimum process condition.
　・Achieving low void while factoring in the effect of contiguous metal substrate and surrounding materials
-- We will meet your needs of any composition, grain size, and flux type. --

| Low alpha solder is the solution for soft-error in bumping | Gold alloy ribbon and pellets |
| Cladded Materials | Fine-fabricated material (Photo-etching fabricated materials)|


                   


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