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Ultra Low Alpha Plating Chemicals

Features

  • Superior stability
  • Plating at high deposition rate
  • Minimal variations in bump height and composition
  • Allows a stable quality in combination with our plating anode products

Product Line-up

Plating Chemical for Wafer side

 Product nameDeposition rate
(μm/min)
Chemistry type
Lead free Plating Chemicals   
Tin-SilverTS-140–2Standard type
TS-2022–7High speed type
TS-140HS3.5–7.5
TS-5203.5–7.5High speed type
(environment-responsive)
Tin TVF-180–7.5Standard type
Tin-Lead Plating Chemicals   
EutecticMX-M03069-574A1–2Standard type
High LeadMX-M07013-571D61.5–7.5High speed type
Cu plating chemical   
 W25~4High speed type

Plating Chemical for Substrate sideNEW! <Under Development>

 Product nameDeposition rate
(μm/min)
Chemistry type
Sn Plating Chemical   
 TF-1000.5~1Filling type

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