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Gold Ribbon and Pellet

Applications of Gold Ribbon and Pellet

Gold Ribbons Pellets are commonly utilized for die bonding of GaAs device and sealing ceramic packages for Telecommunication equipment, that are used in any places on the ground, under the sea, even in outer space, where high reliability is required.

  • IC, LSI, Optical divices
  • Diebond materials
  • Sealing alloys
  • Bonding materials for substrate of communication instrument

Strengths of Gold Ribbon and Pellet

  • Ultra-thin Ribbon & Pellet: As thin as approximately 10um can be achieved.
  • 0.2mm ultra-narrow width ribbon is available.
  • Special surface finishing brings cleaner surface as well as higher wettability.
  • Much less deformation even in the case of severe temperature change.

Product Line-up

  Au Ribbon (AuSn, Au/Ag, Au/Ag/Au)
Product thickness0.3, 0.4, 0.5, 1.0, 1.5, 2.0, 3.0mm
Products width0.7, 1.2, 2.0, 3.0mm
Products length>1m/reel

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