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Introduction of the product under development - Solder paste made with ultra-fine solder powder for C4 bumping

Printing on substrate with ultra-fine pitch using conventional solder pastes is getting harder.
We now offer our newly developed paste made with ultra-fine solder powder that corresponds to fine pitch bumping.

Paste made with ultra fine solder powder for fine pitch bumping
in the next generation

Bump formation on 80μm pitch

backIntroduction of the product under development
- Solder paste made with ultra-fine solder powder for C4 bumping

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