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Low Alpha Anode

Application of Low Alpha Anode

Low Alpha Anode is utilized to replenish metal elements in bump plating process.

Strengths of Low Alpha Anode

  • Alpha-particle emission amount: 0.002cph/cm2
  • Uniform and fine grain size help achieve stable plating with its excellent solubility.
  • High purity of more than 99.99%
  • Comes in various shapes and each has high processing accuracy (Disk, Ring, Pellet, etc.)
  • No use of conflict minerals.
  • Combined with our plating chemicals, our low alpha anode ensures even better performances.

Product Line-up

 Pb-SnSnCu
CompositionPb-63%Sn
Pb-5%Sn
100%SnCu
(P including)
ShapeDisk
Ring
Disk
Ring
Pellet
Disk
Purity≤99.99%
Alpha-particle emission<0.01cph/cm2
<0.002cph/cm2
<0.002cph/cm2
Intended wafer size 8 inch
12 inch

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